Equipment and facilities

  • NeMESYS High Precision Syringe Pump
    NeMESYS High Precision Syringe Pump
  • Agilent 3 GHz Network Analyzer
    Agilent 3 GHz Network Analyzer
  • Agilent 8 GHz Network Analyzer
    Agilent 8 GHz Network Analyzer
  • Vector Voltmeter and Function Generator
    Vector Voltmeter and Function Generator
  • Single Board Electronic Nose
    Single Board Electronic Nose
  • Custom Gas Testing Station
    Custom Gas Testing Station
  • Custom Vapour Testing Station
    Custom Vapour Testing Station
  • Computer Controlled Electronic Nose System
    Computer Controlled Electronic Nose System
  • Integrated Circuit Design Studio
    Integrated Circuit Design Studio
  • Optical Microscopes with Digital Imaging
    Optical Microscopes with Digital Imaging
  • Ultrasonic Wire Bonding Station
    Ultrasonic Wire Bonding Station
  • Karl Suss Mask Aligner Station
    Karl Suss Mask Aligner Station
  • Tempress 602 Wafer Dicing Saw
    Tempress 602 Wafer Dicing Saw
  • CVC LCS-100 Sputtering System
    CVC LCS-100 Sputtering System
  • Envisiontec Prototyping Systems
    Envisiontec Prototyping Systems
  • Autolab Electroplating System
    Autolab Electroplating System
  • Fume Hood with Spin Coater
    Fume Hood with Spin Coater
  • Edwards Auto 306 Sputtering System
    Edwards Auto 306 Sputtering System
  • Thermco Maxi-Brut Furnace
    Thermco Maxi-Brut Furnace
  • BOC Edwards Plasma System
    BOC Edwards Plasma System

 

 

 

 

MICROTECHNOLOGY
Various facilities are available within the Sensors Research Laboratory (SRL) and Centre for Nanotechnology & Microengineering to design, fabricate and test Microsensors, MEMS and Smart devices. A list of these facilities is given below:

Design, Simulation and Analysis Tools

    A comprehensive suite of software tools exist for this area, including:
    • Sensor artwork (L-Edit, Autocad, Cadence)
    • Microelectronic devices (Tanner tools, Cadence, XILINX, MAGIC)
    • PCB production (EASYPC, ORCAD, Cadstar v7)
    • Simulation (PSPICE, HSPICE, Electronic Workbench, ACSL, MATLAB, Solidis, ISE, MEMS PRO, MEMSCAD, Medici, FEMLAB)
    • Programmable devices (PLDs, FPGAs, micros)
    • Data analysis (MATLAB + various toolboxes, Sigmaplot, Pirouette, UNISTAT)

      Cleanroom Facilities Available 

      Deposition of sputtered materials (e.g. gold and platinum), thermally evaporated materials, wide range of resists, electroactive polymers, Langmuir-Blodgett films

      Further facilities include:

        • Isotropic and anisotropic silicon etching
        • Reactive ion etching and PECVD
        • Optical photo-patterning
        • Single-sided and double-sided pattern alignment
        • Focused and showered ion beam milling (centre)
        • On-wafer testing, wafer dicing, wire-bonding, chip packaging and chip testing

          Measurement Facilities Available

           

          In addition to the fabrication facilities listed above a number of measurement techniques are available including:

            • Step profiles (Talystep, Nanostep)
            • Scanning tunnelling, atomic and lateral force microscopies
            • Microstructure: XRD, SEM, TEM, X-ray reflectance, Scanning Auger, Mossbauer spectroscopies
            • X-ray interferometry
            • Ultrasonic characterisation
            • Electrochemical characterisation: cyclic voltammetry, rotating disk electrode and computer-controlled potentiostatic methods (University of Southampton)