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Deposition

The cleanroom is equipped to deposit dielectric and metal films.

 

Dielectric

  • Tetreon (Thermco) LPCVD system incorporating TEOS (Tetraethyl orthosilicate) chemistry allowing the deposition of high quality oxide films from 10-4000nm.
  • ESC 6" target RF sputter system.
  • SVS 8 pocket electron beam evaporator. Integrated ion beam gun for in-situ etch prior and post deposition. Standard dielectrics: Al2O3, MgO, SiO2. Others dielectrics available on request.

 

Metal

  • ESC 6" target DC sputter system. Ti, Al, Mo and Ni(10%V) standard metals.
  • SVS 8 pocket electron beam evaporator. Integrated ion beam gun for in-situ etch prior and post deposition. Standard metals: Ni, Al, Ti, Cr, Pd, Ag, Au, W, Pt. Others metals available on request.

Person loading a sample into the evaporator

Close-up shot of evaporator loading